Description
1.4 in 1 motherboard layering heating module, suitable for 15/15 Pro/15 Pro Max/15 Plus motherboard layering, etc.
2.Precise positioning and constant temperature,One-piece pure copper positioning column to ensure uniform and stable heat transfer and heating, accurate positioning, and efficient layering of the motherboard.
3.Support a variety of chips/general hard disks/fingerprint cables/CPU glue removal and tin removal, accurate card position, non-destructive repair.
4.Hollow heat dissipation holes and silicone anti-slip feet are used at the bottom to effectively isolate the temperature, prevent slippage and efficiently dissipate heat.
5.The main body is made of special synthetic stone material, which is resistant to high temperature and durable.
6.Use with SS T12A host, safe layering, fit without tin explosion, easy to disassemble.
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