Description
Features:
1. Replace tradional swivel jump wire to fill lost solder joints, return to original bearings and without a trace
2. The bearings are reinforced with fixed pins and will never fall off
3. It adopts industrial level printing circuit board copper paper with 30μm thickness
4. Good flatness, which can effectively prevent pseudo solder due to unevenness
5. The connection connection with the circuit is firm, and can keep green oil (UV curing solder ink mask) well
6. Saves time and effort and no need to loop during wire jumping so the repair efficiency is relatively high
7. BGA bonding surface has saturation, stable electrical performance, good welding strength, and not easy to fall off and unsoldering.
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