Mijing Z13 Tin Platform Table – PHONE X/Xs/XsMax

RM102.00

Mijing Z13 Tin Platform Table – PHONE X/Xs/XsMax

Add to Wishlist
Add to Wishlist
SKU: SVC-0635 Categories: ,

Description

MJ 4 in 1 BGA Reballing Stencil Platform Jig Fixure is professional BGA Reballing Stencil Fixture for X/Xs/XsMax, X/Xs/XsMax motherboard BGA reballing fixture tool, is used for positioning and reballing X/Xs/XsMax PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for X/Xs/XsMax BGA reballing and repairing.

Install the X/Xs/XsMax main board on the platform

Cover the X/Xs/XsMax BGA reballing stencil on mainboard

Evenly spread tin on the cover of the reballing stencil

Remove the reballing stencil cover

Take out the motherboard and cooperate with the hot air gun to solidify the tin point.

Additional information

Weight 0.1 kg
Dimensions 6 × 3.8 × 1.3 cm

Reviews

There are no reviews yet.

Only logged in customers who have purchased this product may leave a review.

Close
Categories
New Arrivals
Camera Module
Charging Board / Port
LCD Screen
Part Accessories
Phone Accessories
Ribbon Flex
Service Tools
Small Components
Sound Parts
Select the fields to be shown. Others will be hidden. Drag and drop to rearrange the order.
  • Image
  • SKU
  • Rating
  • Price
  • Stock
  • Availability
  • Add to cart
  • Description
  • Content
  • Weight
  • Dimensions
  • Additional information
Click outside to hide the comparison bar
Compare
X

Add to cart